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GCI Logo- die extraction solutions

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GCI’s attendance at DMSMS Conference held in Denver, CO Nov. 28-Dec. 1st  was a huge success!  GCI’s technology was highlighted in two presentations-   The Naval Surface Warfare Center (NSWC) and the Air Force Research Laboratory (AFLR) each had technical session presentations validating GCI’s Die Extraction and Repackaging (DER) process as a new solution for managing integrated circuit (IC) obsolescence.  

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© 2013 GCI-GLOBAL

Military Obsolescence Issues- die removal, die extraction, die reassembly
Downhole Electronics Solutions- die removal, die extraction, die reassembly
IC Assembly- die removal, die extraction, die reassembly
Die Removal, Die extraction, die reassembly
Hybrid of Multi Chip Module (MCM) Solutions- die removal, die extraction, die reassembly
Die Thinning- die removal, die extraction, die reassembly
Non-Volatile Memory Die Modification for Higher Temperature Operation- die removal, die extraction, die reassembly
IC, Board or System Failure Analysis Services- die removal, die extraction, die reassembly
Hermetic Seal and Vacuum Baking- die removal, die extraction, die reassembly
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