GCI’s attendance at DMSMS Conference held in Denver, CO Nov. 28-Dec. 1st  was a huge success!  GCI’s technology was highlighted in two presentations-   The Naval Surface Warfare Center (NSWC) and the Air Force Research Laboratory (AFLR) each had technical session presentations validating GCI’s Die Extraction and Repackaging (DER) process as a new solution for managing integrated circuit (IC) obsolescence.