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GCI Logo- die extraction solutions

Using our extensive breadth of semiconductor assembly experience, Global Circuit Innovations (GCI) can solve your most challenging IC assembly requirements.  GCI’s onsite assembly capacity can handle low to high volume IC assembly production using  “bare die” or “removed and reassembled die” or any combination thereof.

 

Contact Global Circuit Innovations to discuss your needs.

 

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All die used in our parts are 100% screened for authenticity and can be
used for obsolescence and environmentally hardened products.

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Custom IC Assembly Solutions

CUSTOM IC ASSEMBLY SOLUTIONS

What GCI Offers
IC Assembly

© 2013 GCI-GLOBAL

Military Obsolescence Issues- die removal, die extraction, die reassembly
Downhole Electronics Solutions- die removal, die extraction, die reassembly
IC Assembly- die removal, die extraction, die reassembly
Die Removal, Die extraction, die reassembly
Hybrid of Multi Chip Module (MCM) Solutions- die removal, die extraction, die reassembly
Die Thinning- die removal, die extraction, die reassembly
Non-Volatile Memory Die Modification for Higher Temperature Operation- die removal, die extraction, die reassembly
IC, Board or System Failure Analysis Services- die removal, die extraction, die reassembly
Hermetic Seal and Vacuum Baking- die removal, die extraction, die reassembly
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