top of page
Our Innovations are your Solutions.
Using our extensive breadth of semiconductor assembly experience, Global Circuit Innovations (GCI) can solve your most challenging IC assembly requirements. GCI’s onsite assembly capacity can handle low to high volume IC assembly production using “bare die” or “removed and reassembled die” or any combination thereof.
Contact Global Circuit Innovations to discuss your needs.
Part Search
Don't see a part you need? We can build it!
Fill out the form below to get started and we will get back to you within 24 business hours.
All die used in our parts are 100% screened for authenticity and can be
used for obsolescence and environmentally hardened products.
Custom IC Assembly Solutions
CUSTOM IC ASSEMBLY SOLUTIONS
bottom of page