Global Circuit Innovations (GCI) has the highly-specialized equipment and expertise to thin die and IC packages.  Low profile applications, such as die that are removed and reassembled into lower-profile packages or “stacked die” often require die thinning.  GCI can thin die down to a thickness of 3 mils (or 75μM), if required.

  

Where are lower-profile IC packages are required, GCI can thin packages as well as die.

 

Contact Global Circuit Innovations to discuss your needs.