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GCI Logo- die extraction solutions

Global Circuit Innovations (GCI) has the highly-specialized equipment and expertise to thin die and IC packages.  Low profile applications, such as die that are removed and reassembled into lower-profile packages or “stacked die” often require die thinning.  GCI can thin die down to a thickness of 3 mils (or 75μM), if required.

  

Where are lower-profile IC packages are required, GCI can thin packages as well as die.

 

Contact Global Circuit Innovations to discuss your needs.

Die and Package Thinning

DIE AND PACKAGE THINNING
What GCI Offers
Die Thinning

© 2013 GCI-GLOBAL

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