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GCI Logo- die extraction solutions

Global Circuit Innovations (GCI) specializes in providing environmentally hardened ICs and hybrid solutions for extreme environmental applications.  We use proprietary processes to significantly lengthen the lifetime of an IC at a very high temperature application (e.g.; >175°C) by more than 250 times.

 

Each of the principal members of GCI have decades of experience in the semiconductor industry in IC Failure Analysis, Design, Testing, Assembly, Program Management and Manufacturing as well as PCB and system design, and they apply this experience in supplying highly ruggedized electronic solutions for Downhole Electronics applications as well as other highly demanding applications.

 

GCI offers a broad range of custom Single Chip Modules (SCMs) as well as Multi Chip Modules (MCMs) for the demanding downhole marketplace using “bare die”, “removed die” or any combination thereof.

Downhole Electronics Solutions

DOWNHOLE ELECTRONIC SOLUTIONS

Downhole Electronics Solutions
What GCI Offers

© 2013 GCI-GLOBAL

Military Obsolescence Issues- die removal, die extraction, die reassembly
Downhole Electronics Solutions- die removal, die extraction, die reassembly
 IC Assembly- die removal, die extraction, die reassembly
Die Removal, Die extraction, die reassembly
Hybrid of Multi Chip Module (MCM) Solutions- die removal, die extraction, die reassembly
Die Thinning- die removal, die extraction, die reassembly
Non-Volatile Memory Die Modification for Higher Temperature Operation- die removal, die extraction, die reassembly
IC, Board or System Failure Analysis Services- die removal, die extraction, die reassembly
Hermetic Seal and Vacuum Baking- die removal, die extraction, die reassembly
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