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GCI Logo- die extraction solutions

Global Circuit Innovations (GCI) has the skill and expertise to solve the most difficult technical issues associated with ICs, Printed Circuit Boards or systems.  Our technical staff has handled the most challenging IC issues that a multi-billion dollar semiconductor company experienced from all of their fabs (fabrication facilities) located all around the world.

 

Let us assist you in solving your most challenging technical issues.

 

 

Contact Global Circuit Innovations to discuss your needs.

 

IC, Board or System Failure Analysis Services

IC, BOARD OR SYSTEM FAILURE ANALYSIS SERVICES
What GCI Offers
IC, Board or System Failure Analysis Services

© 2013 GCI-GLOBAL

Military Obsolescence Issues- die removal, die extraction, die reassembly
Downhole Electronics Solutions- die removal, die extraction, die reassembly
IC Assembly- die removal, die extraction, die reassembly
Die Removal, Die extraction, die reassembly
Hybrid of Multi Chip Module (MCM) Solutions- die removal, die extraction, die reassembly
Die Thinning- die removal, die extraction, die reassembly
Non-Volatile Memory Die Modification for Higher Temperature Operation- die removal, die extraction, die reassembly
IC, Board or System Failure Analysis Services- die removal, die extraction, die reassembly
Hermetic Seal and Vacuum Baking- die removal, die extraction, die reassembly
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