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GCI Logo- die extraction solutions

Global Circuit Innovations (GCI) has the highly-specialized equipment and expertise to perform vacuum baking and or vacuum sealing of IC packages with vacuum ranges below 10-5 Torr.

 

Contact Global Circuit Innovations to discuss your needs.

 

Vacuum Baking and/or MEMS Hermetic Vacuum Sealing

VACUUM BAKING AND/OR MEMS HERMETIC VACUUM SEALING
What GCI Offers
Hermetic Seal and Vacuum Baking

© 2013 GCI-GLOBAL

Military Obsolescence Issues- die removal, die extraction, die reassembly
Downhole Electronics Solutions- die removal, die extraction, die reassembly
IC Assembly- die removal, die extraction, die reassembly
Die Removal, Die extraction, die reassembly
Hybrid of Multi Chip Module (MCM) Solutions- die removal, die extraction, die reassembly
Die Thinning- die removal, die extraction, die reassembly
Non-Volatile Memory Die Modification for Higher Temperature Operation- die removal, die extraction, die reassembly
IC, Board or System Failure Analysis Services- die removal, die extraction, die reassembly
Hermetic Seal and Vacuum Baking- die removal, die extraction, die reassembly
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