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GCI Logo- die extraction solutions

Global Circuit Innovations (GCI) specializes in extracting semiconductor die from ANY plastic or ceramic IC package, and then reassembling the “removed” die into an IC package of your choice including rugged, hermetic packages or Multi Chip Modules (MCMs) or make those die are available to you in “bare die” form.

 

We address the following markets and applications:


Obsolescence – ICs that address Diminishing Manufacturing Sources and Material Shortages (DMSMS) for defense, aerospace and industrial

 

Downhole – ICs and MCMs for “downhole” applications extending the IC survivability by >200X in high-temperature (>175C), high-mechanical shock environments

Hybrid Design and Manufacturing – Design engineering services to achieve higher levels of integration

 

Failure Analysis – World-class expertise in IC and system failure analysis

 

IC Assembly – Low volume to high volume Turnkey production capability

 

R&D and Engineering – Rapid prototyping, die and package thinning, die removal and reassembly, FPGA footprint remapping, counterfeit detection and Design Engineering expertise

 

Commitment to Quality Management - ISO 9001:2008 Certified

 

ABOUT US

ISO 9001:2008 Certified

© 2013 GCI-GLOBAL

Military Obsolescence Issues- die removal, die extraction, die reassembly
Downhole Electronics Solutions- die removal, die extraction, die reassembly
IC Assembly- die removal, die extraction, die reassembly
Die Removal, Die extraction, die reassembly
Hybrid of Multi Chip Module (MCM) Solutions- die removal, die extraction, die reassembly
Die Thinning- die removal, die extraction, die reassembly
Non-Volatile Memory Die Modification for Higher Temperature Operation- die removal, die extraction, die reassembly
IC, Board or System Failure Analysis Services- die removal, die extraction, die reassembly
Hermetic Seal and Vacuum Baking- die removal, die extraction, die reassembly
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