Our Innovations are your Solutions.
Global Circuit Innovations (GCI) specializes in extracting semiconductor die from ANY plastic or ceramic IC package, and then reassembling the “removed” die into an IC package of your choice including rugged, hermetic packages or Multi Chip Modules (MCMs) or make those die are available to you in “bare die” form.
We address the following markets and applications:
Obsolescence – ICs that address Diminishing Manufacturing Sources and Material Shortages (DMSMS) for defense, aerospace and industrial
Downhole – ICs and MCMs for “downhole” applications extending the IC survivability by >200X in high-temperature (>175C), high-mechanical shock environments
Hybrid Design and Manufacturing – Design engineering services to achieve higher levels of integration
Failure Analysis – World-class expertise in IC and system failure analysis
IC Assembly – Low volume to high volume Turnkey production capability
R&D and Engineering – Rapid prototyping, die and package thinning, die removal and reassembly, FPGA footprint remapping, counterfeit detection and Design Engineering expertise
Commitment to Quality Management - ISO 9001:2008 Certified
ABOUT US
ISO 9001:2008 Certified
