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GCI Logo- die extraction solutions

Global Circuit Innovations (GCI) performs process development as well as low to high volume IC assembly production using  “bare die” or “removed and reassembled die” or any combination thereof.  This is done for either single die per package (Single Chip Modules or SCMs) or multiple die per package (Multi Chip Modules or MCMs).

 

Contact Global Circuit Innovations to discuss your needs.

 

Hybrid or Multi Chip Module (MCM) Solutions

HYBRID OR MULTI CHIP MODULE (MCM) SOLUTIONS
What GCI Offers
 Non-Volatile Memory Die Modification for Higher Temperature Operation

© 2013 GCI-GLOBAL

Military Obsolescence Issues- die removal, die extraction, die reassembly
Downhole Electronics Solutions- die removal, die extraction, die reassembly
 IC Assembly- die removal, die extraction, die reassembly
Die Removal, Die extraction, die reassembly
Hybrid of Multi Chip Module (MCM) Solutions- die removal, die extraction, die reassembly
Die Thinning- die removal, die extraction, die reassembly
Non-Volatile Memory Die Modification for Higher Temperature Operation- die removal, die extraction, die reassembly
IC, Board or System Failure Analysis Services- die removal, die extraction, die reassembly
Hermetic Seal and Vacuum Baking- die removal, die extraction, die reassembly
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