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Our Innovations are your Solutions.
Global Circuit Innovations (GCI) performs process development as well as low to high volume IC assembly production using “bare die” or “removed and reassembled die” or any combination thereof. This is done for either single die per package (Single Chip Modules or SCMs) or multiple die per package (Multi Chip Modules or MCMs).
Contact Global Circuit Innovations to discuss your needs.
Hybrid or Multi Chip Module (MCM) Solutions
HYBRID OR MULTI CHIP MODULE (MCM) SOLUTIONS
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