What We Offer – Advanced Extraction Solutions (AES) - Die in the Desired Packages or Die in Bare Die Form

 

GCI has developed an advanced, non-destructive, die-extraction technique through our Advanced Extraction Solutions (AES) product line that allows us to remove a die from any semiconductor package making that die available in bare die form to be repackaged in any other available package or used in bare die form.

  

Contact Global Circuit Innovations to discuss your needs.