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GCI Logo- die extraction solutions

What We Offer – Advanced Extraction Solutions (AES) - Die in the Desired Packages or Die in Bare Die Form

 

GCI has developed an advanced, non-destructive, die-extraction technique through our Advanced Extraction Solutions (AES) product line that allows us to remove a die from any semiconductor package making that die available in bare die form to be repackaged in any other available package or used in bare die form.

  

Contact Global Circuit Innovations to discuss your needs.

 

Die Removal with or without Die Reassembly

DIE REMOVAL WITH OR WITHOUT DIE REASSEMBLY
What GCI Offers
Die Removal

© 2013 GCI-GLOBAL

Military Obsolescence Issues- die removal, die extraction, die reassembly
Downhole Electronics Solutions- die removal, die extraction, die reassembly
IC Assembly- die removal, die extraction, die reassembly
Die Removal, Die extraction, die reassembly
Hybrid of Multi Chip Module (MCM) Solutions- die removal, die extraction, die reassembly
Die Thinning- die removal, die extraction, die reassembly
Non-Volatile Memory Die Modification for Higher Temperature Operation- die removal, die extraction, die reassembly
IC, Board or System Failure Analysis Services- die removal, die extraction, die reassembly
Hermetic Seal and Vacuum Baking- die removal, die extraction, die reassembly
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