GCI has developed an advanced, non-destructive, die-extraction technique through our Advanced Extraction Solutions (AES) product line that allows us to remove a die from any semiconductor package making that die available in bare die form to be repackaged in any other available package or used in bare die form.

 

Using GCI’s proprietary techniques, dice can be removed from any plastic or ceramic packages and then reassembled into rugged, hermetic ceramic packages using proprietary materials and techniques in such a manner that their survivability will be increased by more than 250 times at high temperatures above 175°C.

 

GCI can perform this hardening service on ANY commercially available IC from ANY IC manufacturer thereby providing our customers with significantly increased survivability in rugged, high-temperature applications such as downhole oil well drilling and other highly demanding industrial applications.