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GCI Logo- die extraction solutions

If our capability interests you, or if you have a program that could possibly benefit from our technology, please contact us today so we can provide you with a cost-effective proposal to demonstrate that Global Circuit Innovations (GCI) has a solution that will meet your demanding needs.

 

DOWNHOLE ELECTRONIC SOLUTIONS

Downhole Electronics Solutions
What Are the Next Steps?

What are the next steps?

Additional Downhole Electronic Solutions

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Military Obsolescence Issues- die removal, die extraction, die reassembly
Downhole Electronics Solutions- die removal, die extraction, die reassembly
IC Assembly- die removal, die extraction, die reassembly
Die Removal, Die extraction, die reassembly
Hybrid of Multi Chip Module (MCM) Solutions- die removal, die extraction, die reassembly
Die Thinning- die removal, die extraction, die reassembly
Non-Volatile Memory Die Modification for Higher Temperature Operation- die removal, die extraction, die reassembly
IC, Board or System Failure Analysis Services- die removal, die extraction, die reassembly
Hermetic Seal and Vacuum Baking- die removal, die extraction, die reassembly
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