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DOWNHOLE ELECTRONIC SOLUTIONS

Downhole Electronics Solutions
GCI High-Temperature Survivability

The reliability data using our solution.

Our customers can prototype their systems using any ICs in commercial plastic packages from any IC manufacturer.  Once the designs have been proven for suitable performance, we can then selectively replace the ICs in the design with production volumes of Environmentally Hardened versions of the same ICs having identical lead footprints which can replace the plastic ICs on the same boards without a change in lead footprint.

 

In this manner, the system survivability is increased by more than 250X for elevated temperature operation above 175°C.

 

Additional Downhole Electronic Solutions

© 2013 GCI-GLOBAL

Military Obsolescence Issues- die removal, die extraction, die reassembly
Downhole Electronics Solutions- die removal, die extraction, die reassembly
 IC Assembly- die removal, die extraction, die reassembly
Die Removal, Die extraction, die reassembly
Hybrid of Multi Chip Module (MCM) Solutions- die removal, die extraction, die reassembly
Die Thinning- die removal, die extraction, die reassembly
Non-Volatile Memory Die Modification for Higher Temperature Operation- die removal, die extraction, die reassembly
IC, Board or System Failure Analysis Services- die removal, die extraction, die reassembly
Hermetic Seal and Vacuum Baking- die removal, die extraction, die reassembly
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